Winonics serves a diverse base of customers from a variety of key growth markets. Our advanced technology solutions and quick turnaround meet your needs for quality products, on time and without excuses. The resulting valuable and reliable products gives you the competitive advantage your company requires.

Winonics is a leading supplier of complex printed circuit boards, backplanes, antenna assemblies, and various mission ready systems platforms to major OEM customers in the Telecommunications and Networking industries.

We fabricate low to high layer count printed circuit boards and backplanes. This includes high aspect ratio plating, where we understand the importance of signal integrity and impedance control requirements. We offer world-class material and processing expertise in RF & microwave applications, including mixed material constructions, blind and buried via structures and cavity designs which are key competencies our customers can rely upon.

Winonics is a premier North American manufacturer of printed circuit boards for the Aerospace and Defense markets and among the best in the industry for fulfilling the requirements for Aviation, Space, and Defense Quality Management Systems.

Winonics’ collaborative approach to R&D combined with our unique manufacturing capabilities and high standards has been an integral part of our high customer satisfaction ratings and long-term relationships with our global Aerospace and Defense customers.

Winonics is one of the few North American manufacturing facilities to understand and support domestic production of leading edge printed circuit boards (PCB) technologies for Ultra High Density Interconnects (UHDI), RF, Microwave, and Millimeter Wave applications.

In the automotive sector, WINONICS is the strategic supplier of advanced technology, prototype to low to medium volume, high reliability printed circuit boards (PCBs) to automotive electronics manufacturers.

WINONICS has experience fabricating PCBs for all types of sensors and vehicular communication systems used in the automotive industry. We understand how to work with dielectric materials and implement faster signal speeds, which are often essential for these types of printed circuit boards.

From standard products to the most advanced technologies WINONICS’s support the full range of our automotive customers' PCB needs. Our PCBs are used in a broad variety of applications, ranging from as airbags, braking, steering and collision avoidance or radar systems to engine control systems.

Winonics has the experienced teams, materials, and the advanced technology to produce the printed circuit boards that power Industrial Controls and Instrumentation systems.

We help our customer meet the challenges and demands of their product applications while maintaining the highest standards of quality and reliability. We also have a deep understanding of PCB fabrication for the industry, including monitoring devices and downhole sensors.

Winonics is a leading supplier of complex printed circuit boards (PCBs), backplanes, backplane assemblies and micro-electromechanical systems integration to the high-end computing, cloud computing, storage and switch/router sectors.

From the fast growing tablet PC market that requires "any layer" microvia technology to high-end servers and storage systems, Winonics supplies advanced technology PCBs to some of the world's largest companies.

Winonics offers U.S. manufacturing and quick-turn services for advanced technology production to support your high-technology, high-reliability products.

Winonics offers engineered solutions that help enable the realization of 5G Applications. As our customers develop technologies that rely on or enable 5G, our engineering experts are ready with innovative solutions. Our team partners with our customers to support their applications for wireless connectivity, Industry 4.0, IoT, medical, automotive cellular vehicle-to-everything (C-V2X), mission-critical safety applications, networking, computing, and communications.

WINONICS manufactures a range of critical signal path printed circuit boards from the smallest and shortest-range high-density distributed antenna systems to the largest and longest-range solutions.