Winonics 5G Applications
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Winonic’s Capabilities Matrix and Roadmap

Capability / Construction Standard Technology Advanced Technology R&D Current
Layer Count 2-32 40 > 42
Overall Board Thickness (in.) Min. 0.025
Max. 0.300

Panel Size (in.) Min. 12x18
Max. 21x24

Max. 21x26
Minimum Core Thickness (mils) 2 2 1
Trace / Space (mils) 3/3 2/2 <1/1
Minimum Copper Cladding Weight 3/8 oz
Maximum Copper Cladding Weight 2 oz 4 oz 6 oz
HDI Layers 2-3 4+ 10+
Lamination Cycles 2-3 4 5+
Layer Registration .005" .003" .002"
Minimum Drill Size (Mechanical) .0078" .006" .004"
Drill Aspect Ratio (PTH) 10:1 16:1 >20:1
Drill Aspect Ratio (Filled Vias) 8:1 12:1 >12:1
Microvia Aspect Ratio .6:1 .75:1 1:1
Microvia Capture Pad to Hole Diameter .006" .004" .003"
Backdrill Diameter above Prime Drill .010" .007" <.007"
LDI Soldermask Minimum Web .004" .0035" .003"
LDI Soldermask Minimum Clearance .003" .0015" .0015"
Inkjet Legend Printing
White, Green, Red, Blue, Black


  • Certification AS9100D
  • Certification IPC
  • Certification AERO
  • Certification ITAR
  • Certification NIST
  • Certification Reach
  • Certification Rohs
  • Certification UL

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At Winonics we serve people, not markets. Our advanced technology and quick turnaround meet your needs for quality products, on time and without excuses. The resulting valuable and reliable solution gives you the competitive advantage your company requires.

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We set the highest standards for conventional and advanced technology multilayer PCBs and by consistently investing in innovative engineering solutions and advanced process capabilities.

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We are committed to providing convenient and easy access to tools, documentation, support, and up-to-date learning resources to proactively equip and contribute to our partners success.

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Winonics is an invaluable resource in your pursuit of innovative product solutions. From prototyping through dependable full-scale production, our engineering and manufacturing resources are here to ensure that your product, meets or exceeds your expectations every step of the way.

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