Capabilities

Winonic’s Capabilities Matrix and Roadmap

Capability / Construction	Standard Technology	Advanced Technology	R&D Current	R&D Future
Layer Count	18	28	> 36	> 40
Overall Board Thickness (in.)	Min. 0.025 Max. 0.275	Min. 0.025 Max. 0.275	Min. 0.025 Max. 0.300	Min. 0.025 Max. 0.300
Minimum Dielectric Thickness (mils)	2	2	1	1
Minimum Core Thickness (mils)	2	2	1	1
Maximum copper cladding weight, planes	4 oz	4 oz	4 oz	4 oz
Maximum copper cladding weight, signals	2 oz	3 oz	4 oz	4 oz
Minimum copper cladding weight - signals	3/8 oz	3/8 oz	3/8 oz	.25 oz
Maximum copper cladding weight, external	3 oz	3 oz	4 oz	4 oz
Minimum copper weight - external	.25 oz	.25 oz	.25 oz	.25 oz
FR-4 / Multifunctional (Tg 170, RoHs-6, no lead free)	Yes	Yes	Yes	Yes
Nelco 4000-13EP, Nelco 4000- 13EPSI	Yes	Yes	Yes	Yes
Polyimide	Yes	Yes	Yes	Yes
High Tg/Td RoHS Compliant / lead free assembly compatible FR-4	Yes	Yes	Yes	Yes
Capability – Lines / Spaces
Inner Layer Trace / Space (1/2 oz Cu ) (mils)	3.5 / 3.5	3.0 / 3.0	2.5 / 2.5	2/2
Inner Lyr Trace / Space (1 oz Cu ) (mils)	4.0 / 4.0	3.0 / 3.0	3.0 / 3.0	3.0 / 3.0
Outer Layer Trace & Space (+/- mils)	4.0 / 4.0	3.0 / 3.0	3.0 / 3.0	2.5 / 2.5
Capability – Holes
Min. Drilled Through Via (mils) (Driven by aspect ratio)	8	8.0	6.0	6.0

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