Winonic’s Capabilities Matrix and Roadmap
Capability / Construction | Standard Technology | Advanced Technology | R&D Current | R&D Future |
---|---|---|---|---|
Layer Count | 18 | 28 | > 36 | > 40 |
Overall Board Thickness (in.) | Min. 0.025
Max. 0.275 |
Min. 0.025
Max. 0.275 |
Min. 0.025
Max. 0.300 |
Min. 0.025
Max. 0.300 |
Minimum Dielectric Thickness (mils) | 2 | 2 | 1 | 1 |
Minimum Core Thickness (mils) | 2 | 2 | 1 | 1 |
Maximum copper cladding weight, planes | 4 oz | 4 oz | 4 oz | 4 oz |
Maximum copper cladding weight, signals | 2 oz | 3 oz | 4 oz | 4 oz |
Minimum copper cladding weight - signals | 3/8 oz | 3/8 oz | 3/8 oz | .25 oz |
Maximum copper cladding weight, external | 3 oz | 3 oz | 4 oz | 4 oz |
Minimum copper weight - external | .25 oz | .25 oz | .25 oz | .25 oz |
FR-4 / Multifunctional (Tg 170, RoHs-6, no lead free) | Yes | Yes | Yes | Yes |
Nelco 4000-13EP, Nelco 4000- 13EPSI | Yes | Yes | Yes | Yes |
Polyimide | Yes | Yes | Yes | Yes |
High Tg/Td RoHS Compliant / lead free assembly compatible FR-4 | Yes | Yes | Yes | Yes |
Capability – Lines / Spaces | ||||
Inner Layer Trace / Space (1/2 oz Cu ) (mils) | 3.5 / 3.5 | 3.0 / 3.0 | 2.5 / 2.5 | 2/2 |
Inner Lyr Trace / Space (1 oz Cu ) (mils) | 4.0 / 4.0 | 3.0 / 3.0 | 3.0 / 3.0 | 3.0 / 3.0 |
Outer Layer Trace & Space (+/- mils) | 4.0 / 4.0 | 3.0 / 3.0 | 3.0 / 3.0 | 2.5 / 2.5 |
Capability – Holes | ||||
Min. Drilled Through Via (mils) (Driven by aspect ratio) | 8 | 8.0 | 6.0 | 6.0 |
Certifications
Certification Downloads:
- AS 9100D Certified
- ISO 9001:2015 Certified
- ITAR Registered
- IPC 6012 Class 3
- UL Certified